29.92mm heatsink with embedded fan provides lo-noise compact cooling solution for Intel® LGA1700 processors up to 73W TDP in mini-ITX and Micro-ATX chassis.
Intelligent and Optimised Design Hi-performance aluminium heatsink and copper core coupled with an embedded fan that features intelligent PWM function, delivers as much air as needed at any given time to cool the CPU. Coupled with hi-grade thermal interface pre-applied. Ensuring that the cooler delivers outstanding cooling performance.
Extra Large Core Shape, More Cooling Performance The new LGA1700 socket caters for processors with larger package sizes compared to previous desktop processor generations. To ensure maximum contact and thermal transfer, Akasa has increased the contact area between the cooler core and the processor in order to maximise heat dissipation and cooling performance.
Secure Metal Screw Mounting Perfect for the latest Intel LGA1700 socket mounting pattern with extra-safe metal screws and retention plate.
Low-Profile and Compact Maximum heatsink height of 29.92mm which makes it perfect for low-profile systems and Small Form Factor (SFF) such as Mini-ITX, Cube and HTPC cases.
Array of Compatibility Supports common desktop motherboards such as ATX, Micro-ATX, Mini-ITX, and Thin Mini-ITX.
Confezione:
Peso Lordo: 0,33 Kg
Dimensioni Lorde: 100x100x100 mm
Tutti i prezzi NON sono comprensivi di IVA.
Il Listino è in EURO, salvo se diversamente indicato. Marchi e i nomi di prodotti sono registrati dai rispettivi titolari. Dati a cura del Fornitore. Non possiamo essere ritenuti responsabili per eventuali errori o refusi presenti. Prodotti, versioni, prezzi, termini e garanzie sono soggetti a cambiamenti senza preavviso. In ogni rapporto di fornitura valgono le Condizioni Generali di Vendita. Prezzi aggiornati in tempo reale.